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Product overview
Detect less tin, more tin, tip pulling, tin type, etc. of printing solder paste, and measure the height, volume and area of solder paste
Product classification
3D Detection
Product Video
AlS63X Series-SPI
Product Model AlS63X Series-SPI
Product Name Online PCBA 3D solder paste detection equipment
Equipment Structure Diagram
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| 630- B Structural Drawing | 630B-D Structural Drawing |
Product Application Scope
Detect less tin, more tin, tip pulling, tin type, etc. of printing solder paste, and measure the height, volume and area
of solder paste
Test Case
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| Continuous Tinning | Deviation | Less Tin, More Tin | Tin Type Tin Height |
Equipment Principle
The phase modulation profile measurement technology is used to realize the three-dimensional measurement of
precision printing solder paste, which can greatly improve the measurement accuracy while ensuring high-speed
measurement
Core Advantages
1.3 Point lighting
2. Cooperate with the printing machine to realize the closed-loop function
3. Bad board flight identification function and sharing function of&chip mounter BadMark point
4. Minimal programming, one key operation, multi computer interconnection
5. Support whole board graphics storage
6. Support web SPC, and realize real-time SPC monitoring and analysis
Launch Scheme
Can be used behind SMT section printer
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Haozhen Intelligent Technology
Shenzhen Headquarters: 6th Floor, Building B, Xinweirun Industrial Park, Shiwei Community, Matian Street, Guangming District, Shenzhen, Guangdong
Email: assistant@hoztek.com
Message
Dou yin
SMT production line layout tool
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