Product overview
Detection of SMD components and solder defects 3D imaging to minimize shadow problems
Product classification
3D Detection
Product Video
AIS 430-3D Seires
Product Model AIS43X Series-3D
Product Name Online PCBA chip 3D optical detection equipment
Equipment Structure Diagram
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| 430 Structural Drawing | 431D Structural Drawing |
Product Application Scope
Detection of SMD components and solder defects 3D imaging to minimize shadow problems
Test Case
| 430-3D - Collection of patch detection cases | |||
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| Wrong Piece | Counterparts | Floating Height | Silk Screen |
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| Set Up A Monument | Missing Parts | Deviation | Cockle One's Feet |
| 430-3d Collection Of Solder Test Cases | |||
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| Continuous Tinning | Faulty Soldering | Tin Bead | |
Equipment Principle
Through the 3D structured light imaging system and algorithm with high degree of reduction, the height is accurately measured, and the judgment basis is effectively provided to help more accurately judge defects and defects
Core Advantages
1. Intelligent de-noising of depth map is adopted to solve the problem of 3D imaging distortion
2. The measuring height range can be configured to meet various application requirements
3. Adopt dynamic adaptive datum technology to automatically correct the height of substrate
4. Multi frequency algorithm increases robustness and reduces the impact of brightness changes on imaging
Launch Scheme
Can be used after reflow soldering of SMT section

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