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Product overview

Detection of SMD components and solder defects 3D imaging to minimize shadow problems

Product classification

3D Detection


Product Video

AIS430-3D.mp4

AIS 430-3D Seires

Product Model AIS43X Series-3D

 

Product Name  Online PCBA chip 3D optical detection equipment

 

Equipment Structure Diagram

 

430 Structural Drawing 431D Structural Drawing

 

 

Product Application Scope

Detection of SMD components and solder defects 3D imaging to minimize shadow problems

 

Test Case

 

430-3D - Collection of patch detection cases
Wrong Piece Counterparts Floating Height Silk Screen
Set Up A Monument Missing Parts Deviation Cockle One's Feet

 

 

430-3d Collection Of Solder Test Cases
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Continuous Tinning Faulty Soldering Tin Bead

 

Equipment Principle

Through the 3D structured light imaging system and algorithm with high degree of reduction, the height is accurately measured, and the judgment basis is effectively provided to help more accurately judge defects and defects

 

Core Advantages

1. Intelligent de-noising of depth map is adopted to solve the problem of 3D imaging distortion

2. The measuring height range can be configured to meet various application requirements

3. Adopt dynamic adaptive datum technology to automatically correct the height of substrate

4. Multi frequency algorithm increases robustness and reduces the impact of brightness changes on imaging

 

Launch Scheme

Can be used after reflow soldering of SMT section

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