-
Language
Product overview
Detect solder defects of DIP components
Product classification
DIP Detection And Final Inspection
Product Video
AIS30X Seires
Product Name AIS30X Series-DIP
Product Name Online PCBA solder optical detection equipment
Equipment Structure Diagram
 |
 |
| 303 Structural Drawing | 303L Structural Drawing |
Product Application Scope
Detect solder defects of DIP components
Test Case
| Tin Bead | Little Tin | Polytin | Continuous Tinning | No Missing Parts | Empty Welding | Faulty Soldering |
 |
 |
 |
|
 |
 |
 |
Equipment Principle
Grab the board card image in real time with high-precision color industrial camera, adopt convolutional neural network algorithm to process the image, and intelligently judge the defective components and solder joints
Core Advantages
1. Three section track design, high speed and high precision, continuous stability and low wear
2. AI algorithm, one click search and positioning, fast and simple programming
3. Strong detection capability, effectively intercepting various adverse conditions such as copper exposure and tin deficiency
4. Flexible cooperation with production line to adapt to various production scenarios
5. Data traceability, support SPC alarm
6. Automatic lens cleaning function reduces maintenance frequency
Launch Scheme
After wave soldering furnace
Related Products
Leave a Message
Haozhen Intelligent Technology
Shenzhen Headquarters: 6th Floor, Building B, Xinweirun Industrial Park, Shiwei Community, Matian Street, Guangming District, Shenzhen, Guangdong
Email: assistant@hoztek.com
Message
Dou yin
SMT production line layout tool
Follow us